Chris Higgins Quoted in 3Dnatives Article

3Dnatives
November.06.2017

Orrick Senior Associate Chris Higgins is quoted in the 3Dnatives article, "Our Guide to Intellectual Property in 3D Printing." In it, he explains Creative Commons licenses and a simple way to prevent potential copyright infringement. To view the full article, please visit here.

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Christopher Higgins Partner, Patents, 3D Printing

Washington, D.C.

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D:+1 202 339 8418
E: [email protected]

Practice:

Technology & Innovation Sector
Patents
3D Printing
U.S. International Trade Commission
Life Sciences & HealthTech
Intellectual Property
Inter Partes Review (IPR)
IP Counseling & Due Diligence

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Christopher Higgins Partner

Washington, D.C.

Chris has developed a global reputation as an authoritative source on legal issues in 3D printing, and has been a featured speaker at 3D printing events around the world. His 3D printing practice includes advising startups and established 3D printing companies on all aspects of intellectual property law, cybersecurity, and technology transactions. Chris helps 3D printing clients grow their businesses and capitalize on market opportunities and represents them in court to defend or enforce IP rights. Chris' 3D printing work extends beyond the courtroom; he teaches a course at Penn State University as part of its Masters of Engineering in Additive Manufacturing and Design program.

Chris' patent litigation and IPR practice also covers a wide range of other technologies including graphics processing, digital image processing and printing, semiconductor devices and semiconductor manufacturing, data encryption, high-definition television, digital content recognition, and medical devices. Chris has also assisted clients with licensing and patent prosecution related to 3D printing, digital imaging, wireless technology, mobile communication devices, encryption, high-definition television and medical devices.

Prior to law school, Chris worked in the patent department of a medical device company and as an engineer designing electronic components for missiles, projectiles, and bombs.